For AIOT applications with circular smart screens and compact structural design, DWIN Technology has reduced the package on the basis of the T5L0 chip that has been used stably and in large quantities. The new small package chip has been reduced from the original 18*18mm (LQFP128 package) to 9*9mm (QFN88 package), the area is reduced by 75%.
The T5L0 chip with a smaller package is named T5L0_Q88. The difference between T5L0_Q88 and T5L0 is that the peripheral interface of the OS core is cut, and the performance of the GUI core is the same. At present, the first batch of samples and development boards have been tested and verified, and the T5L0 chip in QFN88 package will be officially released and launched on the market from now on!
Chip physical map:
T5L0_Q88 package diagram:
Post time: May-18-2023